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Part Number Overview
Manufacturer Part Number
ESQT-113-02-F-D-635
Description
CONN SOCKET 26POS 0.079 GOLD PCB
Detailed Description
26 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold
Manufacturer
Samtec Inc.
Standard LeadTime
Edacad Model
ESQT-113-02-F-D-635 Models
Standard Package
Supplier Stocks
Technical specifications
Mfr
Samtec Inc.
Series
ESQT
Package
Bulk
Product Status
Active
Connector Type
Elevated Socket
Contact Type
Forked
Style
Board to Board or Cable
Number of Positions
26
Number of Positions Loaded
All
Pitch - Mating
0.079" (2.00mm)
Number of Rows
2
Row Spacing - Mating
0.079" (2.00mm)
Mounting Type
Through Hole
Termination
Solder
Fastening Type
Push-Pull
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
3.00µin (0.076µm)
Insulation Color
Black
Insulation Height
0.635" (16.13mm)
Contact Length - Post
0.215" (5.46mm)
Operating Temperature
-55°C ~ 125°C
Material Flammability Rating
UL94 V-0
Contact Finish - Post
Tin
Mated Stacking Heights
-
Ingress Protection
-
Features
-
Current Rating (Amps)
4.5A per Contact
Voltage Rating
-
Applications
-
Insulation Material
Liquid Crystal Polymer (LCP)
Contact Shape
Square
Contact Material
Phosphor Bronze
Contact Finish Thickness - Post
-
Base Product Number
ESQT-113
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
8536.69.4040
California Prop 65
Other Names
-
Category
/Product Index/Connectors, Interconnects/Rectangular Connectors/Headers, Receptacles, Female Sockets/Samtec Inc. ESQT-113-02-F-D-635
Documents & Media
CAD Models
1(ESQT-113-02-F-D-635 Models)
EDA Models
1(ESQT-113-02-F-D-635 Models)
Quantity Price
-
Substitutes
-