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Part Number Overview
Manufacturer Part Number
40-6554-18
Description
CONN IC DIP SOCKET ZIF 40POS
Detailed Description
40 (2 x 20) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Nickel Boron Through Hole
Manufacturer
Aries Electronics
Standard LeadTime
6 Weeks
Edacad Model
Standard Package
7
Supplier Stocks
Technical specifications
Mfr
Aries Electronics
Series
55
Package
Bulk
Product Status
Active
Type
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
40 (2 x 20)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Nickel Boron
Contact Finish Thickness - Mating
50.0µin (1.27µm)
Contact Material - Mating
Beryllium Nickel
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Nickel Boron
Contact Finish Thickness - Post
50.0µin (1.27µm)
Contact Material - Post
Beryllium Nickel
Housing Material
Polyetheretherketone (PEEK), Glass Filled
Operating Temperature
-55°C ~ 250°C
Termination Post Length
0.110" (2.78mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
-
Base Product Number
40-6554
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
Q1677728
40-6554-18-NDR
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 40-6554-18
Documents & Media
Datasheets
1(xx-x55x-1-8 Series)
Environmental Information
()
HTML Datasheet
1(xx-x55x-1-8 Series)
Quantity Price
Quantity: 7
Unit Price: $140.29571
Packaging: Bulk
MinMultiplier: 7
Packaging: Bulk
MinMultiplier: 7
Substitutes
-