Mfr
CTS Thermal Management Products
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Fin Height
0.555" (14.10mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
6.30°C/W @ 400 LFM
Thermal Resistance @ Natural
20.80°C/W
Material Finish
Black Anodized
Base Product Number
BDN10