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Part Number Overview
Manufacturer Part Number
TC1-200G
Description
HEAT SINK COMPOUND - HIGH DENSIT
Detailed Description
Thermal Silicone Compound 200 gram Jar
Manufacturer
Chip Quik Inc.
Standard LeadTime
4 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
-
Package
Bulk
Product Status
Active
Type
Silicone Compound
Size / Dimension
200 gram Jar
Usable Temperature Range
-
Color
White
Thermal Conductivity
0.67W/m-K
Features
-
Shelf Life
60 Months
Storage/Refrigeration Temperature
37°F ~ 77°F (3°C ~ 25°C)
Material Flammability Rating
-
Shelf Life Start
Date of Manufacture
Shipping Info
Shipped from allaboutcomponents.com
allaboutcomponents.com Storage
-
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3403.99.0000
Other Names
-
Category
/Product Index/Fans, Thermal Management/Thermal/Adhesives, Epoxies, Greases, Pastes/Chip Quik Inc. TC1-200G
Documents & Media
Datasheets
1(TC1-200G Datasheet)
MSDS Material Safety Datasheet
1(Thermal Paste SDS)
HTML Datasheet
1(TC1-200G Datasheet)
Quantity Price
Quantity: 1
Unit Price: $49.95
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-