Mfr
CTS Thermal Management Products
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Fin Height
0.500" (12.70mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
4.00°C/W @ 200 LFM
Thermal Resistance @ Natural
-
Material Finish
Black Anodized
Base Product Number
APF19