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Part Number Overview
Manufacturer Part Number
EV_MOD_CH101-01-02
Description
CHIRP EVALUATION MODULE CH101
Detailed Description
CH101 - Ultrasonic, 3D Time-of-Flight (ToF) Sensor Evaluation Board
Manufacturer
TDK InvenSense
Standard LeadTime
28 Weeks
Edacad Model
Standard Package
100
Supplier Stocks
Technical specifications
Mfr
TDK InvenSense
Series
-
Package
Tray
Product Status
Active
Sensor Type
Ultrasonic, 3D Time-of-Flight (ToF)
Sensing Range
4cm ~ 1.2m
Interface
I2C
Sensitivity
-
Voltage - Supply
1.62V ~ 1.98V
Embedded
-
Supplied Contents
Board(s)
Utilized IC / Part
CH101
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
9015.10.4000
Other Names
-
Category
/Product Index/Development Boards, Kits, Programmers/Evaluation Boards/Sensor Evaluation Boards/TDK InvenSense EV_MOD_CH101-01-02
Documents & Media
Datasheets
1(EV_MOD_CH101-01-02 User Guide)
HTML Datasheet
1(EV_MOD_CH101-01-02 User Guide)
Quantity Price
Quantity: 1
Unit Price: $17.46
Packaging: Tray
MinMultiplier: 1
Packaging: Tray
MinMultiplier: 1
Substitutes
-