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Part Number Overview
Manufacturer Part Number
TS991AX500T4
Description
SOLDER PASTE THERMALLY STABLE NC
Detailed Description
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 17.64 oz (500g)
Manufacturer
Chip Quik Inc.
Standard LeadTime
4 Weeks
Edacad Model
Standard Package
1
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
CHIPQUIK®
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Sn63Pb37 (63/37)
Diameter
-
Melting Point
361°F (183°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Leaded
Form
Jar, 17.64 oz (500g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Base Product Number
TS991A
Environmental & Export Classifications
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Affected
ECCN
EAR99
HTSUS
3810.10.0000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. TS991AX500T4
Documents & Media
Datasheets
1(TS991AX500T4 Datasheet)
Quantity Price
Quantity: 1
Unit Price: $105.77
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-