Mfr
Cinch Connectivity Solutions
Card Type
Non Specified - Dual Edge
Number of Positions/Bay/Row
22
Card Thickness
0.054" ~ 0.071" (1.37mm ~ 1.80mm)
Mounting Type
Panel Mount
Termination
Solder Eyelet(s)
Contact Material
Beryllium Copper
Contact Finish Thickness
30.0µin (0.76µm)
Contact Type
Bifurcated Semi Bellows
Flange Feature
Flush Mount, Top Opening, Unthreaded, 0.128" (3.25mm) Dia
Operating Temperature
-65°C ~ 125°C
Material - Insulation
Diallyl Phthalate (DAP)
Base Product Number
50-44S