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Part Number Overview
Manufacturer Part Number
24-526-11
Description
CONN IC DIP SOCKET ZIF 24POS GLD
Detailed Description
24 (2 x 12) Pos DIP, ZIF (ZIP) Socket Gold Through Hole
Manufacturer
Aries Electronics
Standard LeadTime
6 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Aries Electronics
Series
Lo-PRO®file, 526
Package
Bulk
Product Status
Active
Type
DIP, ZIF (ZIP)
Number of Positions or Pins (Grid)
24 (2 x 12)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Material - Post
Beryllium Copper
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.105" (2.67mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
24-526
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
-
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 24-526-11
Documents & Media
Datasheets
1(526 Series)
Environmental Information
()
HTML Datasheet
1(526 Series)
Quantity Price
Quantity: 34
Unit Price: $15.99382
Packaging: Bulk
MinMultiplier: 34
Packaging: Bulk
MinMultiplier: 34
Substitutes
-