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Part Number Overview
Manufacturer Part Number
MPC8313EVRAGDC
Description
IC MPU POWERQUICC II PRO 516PBGA
Detailed Description
Microprocessor IC * 516-TEPBGA (27x27)
Manufacturer
NXP USA Inc.
Standard LeadTime
52 Weeks
Edacad Model
Standard Package
40
Supplier Stocks
Technical specifications
Mfr
NXP USA Inc.
Series
*
Package
Tray
Product Status
Active
Mounting Type
Surface Mount
Package / Case
516-BBGA Exposed Pad
Supplier Device Package
516-TEPBGA (27x27)
Base Product Number
MPC8313
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A002A1 NXP
HTSUS
8542.31.0001
Other Names
935324355557
NXPNXPMPC8313EVRAGDC
2156-MPC8313EVRAGDC
Category
/Product Index/Integrated Circuits (ICs)/Embedded/Microprocessors/NXP USA Inc. MPC8313EVRAGDC
Documents & Media
Datasheets
1(MPC8313E Hrdw Specifications)
Environmental Information
()
PCN Design/Specification
1(MPC8313 Copper Bond Wire 03/Jul/2014)
PCN Packaging
()
Quantity Price
Quantity: 40
Unit Price: $47.40175
Packaging: Tray
MinMultiplier: 40
Packaging: Tray
MinMultiplier: 40
Substitutes
-