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Part Number Overview
Manufacturer Part Number
BGA0019-S
Description
BGA-36 (0.4 MM PITCH, 6 X 6 GRID
Detailed Description
Manufacturer
Chip Quik Inc.
Standard LeadTime
3 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
Proto-Advantage BGA
Package
Bulk
Product Status
Active
Type
BGA
Number of Positions
36
Pitch
0.016" (0.40mm)
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension
-
Thermal Center Pad
-
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
7326.90.8688
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder Stencils, Templates/Chip Quik Inc. BGA0019-S
Documents & Media
Datasheets
1(BGA0019-S)
Video File
1(Prototyping with Solder Stencils - Another Teaching Moment | allaboutcomponents.com Electronics)
HTML Datasheet
1(BGA0019-S)
Quantity Price
Quantity: 1
Unit Price: $20.99
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-