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Part Number Overview
Manufacturer Part Number
IPC0171-S
Description
BGA-25 (1MM PITCH, 8X6MM BODY) S
Detailed Description
Manufacturer
Chip Quik Inc.
Standard LeadTime
2 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
Proto-Advantage IPC
Package
Bulk
Product Status
Active
Type
BGA
Number of Positions
25
Pitch
0.039" (1.00mm)
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension
0.315" L x 0.236" W (8.00mm x 6.00mm)
Thermal Center Pad
-
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8515.19.0000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder Stencils, Templates/Chip Quik Inc. IPC0171-S
Documents & Media
Datasheets
()
Video File
1(Prototyping with Solder Stencils - Another Teaching Moment | allaboutcomponents.com Electronics)
HTML Datasheet
1(IPC0171-S)
Quantity Price
Quantity: 1
Unit Price: $11.59
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-