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Part Number Overview
Manufacturer Part Number
DIP300T600P08
Description
DIP-8 (0.3" BODY) TO DIP-8 (0.6"
Detailed Description
Manufacturer
Chip Quik Inc.
Standard LeadTime
4 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
Proto-Advantage
Package
Bulk
Product Status
Active
Proto Board Type
DIP to DIP
Package Accepted
-
Number of Positions
8
Pitch
0.100" (2.54mm)
Board Thickness
0.063" (1.60mm)
Material
FR4 Epoxy Glass
Size / Dimension
0.700" L x 0.400" W (17.78mm x 10.16mm)
Base Product Number
DIP300
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8534.00.0070
Other Names
-
Category
/Product Index/Prototyping, Fabrication Products/Adapter, Breakout Boards/Chip Quik Inc. DIP300T600P08
Documents & Media
Datasheets
1(DIP300T600P08 Datasheet)
HTML Datasheet
1(DIP300T600P08 Datasheet)
Quantity Price
Quantity: 1
Unit Price: $1.69
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-