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Part Number Overview
Manufacturer Part Number
514-83-500M30-001148
Description
CONN SOCKET BGA 500POS GOLD
Detailed Description
500 (30 x 30) Pos BGA Socket Gold Surface Mount
Manufacturer
Preci-Dip
Standard LeadTime
20 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Preci-Dip
Series
514
Package
Bulk
Product Status
Active
Type
BGA
Number of Positions or Pins (Grid)
500 (30 x 30)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
29.5µin (0.75µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Surface Mount
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
-
Contact Material - Post
Brass
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.055" (1.40mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
10mOhm
Base Product Number
514-83
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
-
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Preci-Dip 514-83-500M30-001148
Documents & Media
Datasheets
()
Video File
1(PRODUCT DESIGN TIPS v017 microPGA Sockets and BGA Adapters)
Environmental Information
1(Preci-Dip Regulatory Info)
HTML Datasheet
1(514-xx-yyyMxx-zzz148)
Quantity Price
Quantity: 351
Unit Price: $60.11738
Packaging: Bulk
MinMultiplier: 351
Packaging: Bulk
MinMultiplier: 351
Substitutes
-