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Part Number Overview
Manufacturer Part Number
67B8G2507006215R00
Description
SP,CON,8,AU,TNR
Detailed Description
Manufacturer
Laird Technologies EMI
Standard LeadTime
5 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Laird Technologies EMI
Series
-
Package
Bulk
Product Status
Active
Type
Fingerstock
Shape
-
Width
0.098" (2.50mm)
Length
0.276" (7.00mm)
Height
0.244" (6.20mm)
Material
Beryllium Copper
Plating
Gold
Plating - Thickness
-
Attachment Method
Solder
Operating Temperature
-
Shelf Life Start
-
Shelf Life
12 Months
Storage/Refrigeration Temperature
50°F ~ 77°F (10°C ~ 25°C)
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
8529.90.9800
Other Names
-
Category
/Product Index/RF and Wireless/RFI and EMI - Contacts, Fingerstock and Gaskets/Laird Technologies EMI 67B8G2507006215R00
Documents & Media
Datasheets
1(67B8G2507006215R00)
Video File
1(Laird’s Precision Metals Production and Design Capabilities Overview)
Quantity Price
Quantity: 3600
Unit Price: $0.72114
Packaging: Bulk
MinMultiplier: 3600
Packaging: Bulk
MinMultiplier: 3600
Substitutes
-