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Part Number Overview
Manufacturer Part Number
SEAMP-50-02.0-S-08
Description
CONN HD ARRAY M 400POS PRESS-FIT
Detailed Description
400 Position Connector High Density Array, Male Through Hole Gold
Manufacturer
Samtec Inc.
Standard LeadTime
5 Weeks
Edacad Model
Standard Package
30
Supplier Stocks
Technical specifications
Mfr
Samtec Inc.
Series
SEARAY™ SEAMP
Package
Tray
Product Status
Active
Connector Type
High Density Array, Male
Number of Positions
400
Pitch
0.050" (1.27mm)
Number of Rows
8
Mounting Type
Through Hole
Features
-
Contact Finish
Gold
Contact Finish Thickness
30.0µin (0.76µm)
Mated Stacking Heights
7mm, 8mm, 8.5mm
Height Above Board
0.181" (4.60mm)
Base Product Number
SEAMP-50
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
-
Category
/Product Index/Connectors, Interconnects/Rectangular Connectors/Arrays, Edge Type, Mezzanine (Board to Board)/Samtec Inc. SEAMP-50-02.0-S-08
Documents & Media
Datasheets
1(SEAMP Series Datasheet)
Featured Product
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Quantity Price
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Substitutes
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