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Part Number Overview
Manufacturer Part Number
67BCG2003201508R00
Description
SP,CON,C,AU,TNR
Detailed Description
Manufacturer
Laird Technologies EMI
Standard LeadTime
5 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Laird Technologies EMI
Series
BCG
Package
Bulk
Product Status
Active
Type
Fingerstock
Shape
-
Width
0.078" (2.00mm)
Length
0.126" (3.20mm)
Height
0.059" (1.50mm)
Material
Beryllium Copper
Plating
Gold
Attachment Method
Solder
Shelf Life Start
Date of Shipment
Shelf Life
24 Months
Storage/Refrigeration Temperature
50°F ~ 77°F (10°C ~ 25°C)
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
8529.90.9800
Other Names
-
Category
/Product Index/RF and Wireless/RFI and EMI - Contacts, Fingerstock and Gaskets/Laird Technologies EMI 67BCG2003201508R00
Documents & Media
Datasheets
1(67BCG2003201508R00)
Video File
1(Laird’s Precision Metals Production and Design Capabilities Overview)
HTML Datasheet
1(67BCG2003201508R00 Drawing)
Product Drawings
1(67BCG2003201508R00 Drawing)
Quantity Price
Quantity: 8000
Unit Price: $0.44258
Packaging: Bulk
MinMultiplier: 8000
Packaging: Bulk
MinMultiplier: 8000
Substitutes
-