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Part Number Overview
Manufacturer Part Number
50-01-0584-0208
Description
SILVER EMI EPOXY 16OZ KIT
Detailed Description
RF EMI EMI Conductive Adhesive CHO-BOND® 584-208 Epoxy, 2 Part X X
Manufacturer
Parker Chomerics
Standard LeadTime
2 Weeks
Edacad Model
Standard Package
1
Supplier Stocks
Technical specifications
Mfr
Parker Chomerics
Series
CHO-BOND® 584-208
Package
Bulk
Product Status
Active
Type
EMI Conductive Adhesive
Shape
-
Length
-
Width
-
Thickness - Overall
-
Operating Temperature
-
Adhesive
-
Material
Epoxy, 2 Part
Shelf Life
9 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
77°F (25°C)
Base Product Number
50-01
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
HTSUS
0000.00.0000
California Prop 65
Other Names
-
Category
/Product Index/RF and Wireless/RFI and EMI - Shielding and Absorbing Materials/Parker Chomerics 50-01-0584-0208
Documents & Media
Datasheets
1(Datasheet)
Other Related Documents
1(Part Number Letter Document)
MSDS Material Safety Datasheet
1(CHO-BOND® 208 Epoxy Hardener SDS)
Environmental Information
1(Parker Chomerics Environmental Cert)
HTML Datasheet
1(CHO-BOND® 584-208)
Quantity Price
Quantity: 1
Unit Price: $7313.78
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-