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Part Number Overview
Manufacturer Part Number
ACC-HS3-SET
Description
ACC HEATSINK ME ACC-HS3
Detailed Description
Heat Sink
Manufacturer
Enclustra FPGA Solutions
Standard LeadTime
12 Weeks
Edacad Model
Standard Package
1
Supplier Stocks
Technical specifications
Mfr
Enclustra FPGA Solutions
Series
-
Package
Box
Product Status
Active
Type
-
Package Cooled
-
Attachment Method
Bolt On
Shape
Rectangular
Length
2.205" (56.00mm)
Width
1.063" (27.00mm)
Diameter
-
Fin Height
0.571" (14.50mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
-
Material Finish
-
Shelf Life
-
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8473.30.5100
Other Names
2879-ACC-HS3-SET
2879-EN103119-ND
2879-EN103119
EN103119
Category
/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/Enclustra FPGA Solutions ACC-HS3-SET
Documents & Media
-
Quantity Price
Quantity: 250
Unit Price: $31.74304
Packaging: Box
MinMultiplier: 1
Packaging: Box
MinMultiplier: 1
Quantity: 100
Unit Price: $33.6103
Packaging: Box
MinMultiplier: 1
Packaging: Box
MinMultiplier: 1
Quantity: 50
Unit Price: $34.8552
Packaging: Box
MinMultiplier: 1
Packaging: Box
MinMultiplier: 1
Quantity: 25
Unit Price: $37.3448
Packaging: Box
MinMultiplier: 1
Packaging: Box
MinMultiplier: 1
Quantity: 10
Unit Price: $39.834
Packaging: Box
MinMultiplier: 1
Packaging: Box
MinMultiplier: 1
Quantity: 1
Unit Price: $42.32
Packaging: Box
MinMultiplier: 1
Packaging: Box
MinMultiplier: 1
Substitutes
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