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Part Number Overview
Manufacturer Part Number
67SLG040040025PI00
Description
METAL FILM OVER FOAM CONTACTS
Detailed Description
Manufacturer
Laird Technologies EMI
Standard LeadTime
Edacad Model
Standard Package
1,800
Supplier Stocks
Technical specifications
Mfr
Laird Technologies EMI
Series
SMD Grounding Metallized
Package
Tape & Reel (TR)
Product Status
Active
Type
Film Over Foam
Shape
Rectangle
Width
0.157" (4.00mm)
Length
0.098" (2.50mm)
Height
0.157" (4.00mm)
Material
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Plating
-
Plating - Thickness
-
Attachment Method
Solder
Operating Temperature
-40°C ~ 70°C
Shelf Life Start
-
Shelf Life
-
Storage/Refrigeration Temperature
-
Environmental & Export Classifications
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
8536.90.4000
Other Names
903-1589-6
903-1589-2
903-1589-1
Category
/Product Index/RF and Wireless/RFI and EMI - Contacts, Fingerstock and Gaskets/Laird Technologies EMI 67SLG040040025PI00
Documents & Media
Datasheets
()
Video File
1(Laird’s Precision Metals Production and Design Capabilities Overview)
HTML Datasheet
1(Soft SMD Grounding Contacts)
Quantity Price
-
Substitutes
-