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20250417
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SBB0802P-1
Part Number Overview
Manufacturer Part Number
SBB0802P-1
Description
SOLDER-IN BREADBOARD 1X1" (8 ROW
Detailed Description
Breadboard, General Purpose Plated Through Hole (PTH) Pad Per Hole (Round) 0.1" (2.54mm) Grid
Manufacturer
Chip Quik Inc.
Standard LeadTime
4 Weeks
Edacad Model
Standard Package
Supplier Stocks
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Technical specifications
Mfr
Chip Quik Inc.
Series
Proto-Advantage
Package
Bulk
Product Status
Active
Proto Board Type
Breadboard, General Purpose
Plating
Plated Through Hole (PTH)
Pitch
0.1" (2.54mm) Grid
Circuit Pattern
Pad Per Hole (Round)
Edge Contacts
-
Hole Diameter
0.039" (1.00mm)
Size / Dimension
1.00" L x 1.00" W (25.4mm x 25.4mm)
Board Thickness
0.063" (1.60mm)
Material
FR4 Epoxy Glass
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8534.00.0040
Other Names
-
Category
/Product Index/Prototyping, Fabrication Products/Prototype Boards Perforated/Chip Quik Inc. SBB0802P-1
Documents & Media
-
Quantity Price
Quantity: 1
Unit Price: $2.38
Packaging: Bulk
MinMultiplier: 1
Substitutes
-
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