Part Number Overview

Manufacturer Part Number
HSB08-212106
Description
HEAT SINK, BGA, 21 X 21 X 6 MM
Detailed Description
Heat Sink BGA Aluminum Alloy 3.0W @ 75°C Top Mount
Manufacturer
CUI Devices
Standard LeadTime
16 Weeks
Edacad Model
Standard Package
1,872
Supplier Stocks

Technical specifications

Mfr
CUI Devices
Series
HSB
Package
Box
Product Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
0.827" (21.00mm)
Width
0.827" (21.00mm)
Diameter
-
Fin Height
0.236" (6.00mm)
Power Dissipation @ Temperature Rise
3.0W @ 75°C
Thermal Resistance @ Forced Air Flow
9.70°C/W @ 200 LFM
Thermal Resistance @ Natural
25.40°C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

Environmental & Export Classifications

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8473.30.5100

Other Names

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Category

/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/CUI Devices HSB08-212106

Documents & Media

Datasheets
1(HSB08-212106)
Other Related Documents
1(How to Select a Heat Sink)
Video File
1(How to Select a Heat Sink)
Environmental Information
1(HSB08-212106 RoHS/REACH)
Design Resources
1(Heat Sink Calculator)
Featured Product
()
HTML Datasheet
1(HSB08-212106)

Quantity Price

Quantity: 5000
Unit Price: $0.59105
Packaging: Box
MinMultiplier: 1
Quantity: 1000
Unit Price: $0.61216
Packaging: Box
MinMultiplier: 1
Quantity: 500
Unit Price: $0.67548
Packaging: Box
MinMultiplier: 1
Quantity: 250
Unit Price: $0.71772
Packaging: Box
MinMultiplier: 1
Quantity: 100
Unit Price: $0.7705
Packaging: Box
MinMultiplier: 1
Quantity: 50
Unit Price: $0.781
Packaging: Box
MinMultiplier: 1
Quantity: 25
Unit Price: $0.802
Packaging: Box
MinMultiplier: 1
Quantity: 10
Unit Price: $0.844
Packaging: Box
MinMultiplier: 1
Quantity: 1
Unit Price: $0.89
Packaging: Box
MinMultiplier: 1

Substitutes

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