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Part Number Overview
Manufacturer Part Number
HSB22-606010
Description
HEAT SINK, BGA, 60 X 60 X 10 MM
Detailed Description
Heat Sink BGA Aluminum 9.8W @ 75°C Top Mount
Manufacturer
CUI Devices
Standard LeadTime
16 Weeks
Edacad Model
Standard Package
500
Supplier Stocks
Technical specifications
Mfr
CUI Devices
Series
HSB
Package
Box
Product Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
2.362" (60.00mm)
Width
2.362" (60.00mm)
Diameter
-
Fin Height
0.394" (10.00mm)
Power Dissipation @ Temperature Rise
9.8W @ 75°C
Thermal Resistance @ Forced Air Flow
2.60°C/W @ 200 LFM
Thermal Resistance @ Natural
7.62°C/W
Material
Aluminum
Material Finish
Black Anodized
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8473.30.5100
Other Names
-
Category
/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/CUI Devices HSB22-606010
Documents & Media
Datasheets
1(HSB22-606010 Datasheet)
Other Related Documents
1(How to Select a Heat Sink)
Environmental Information
1(HSB22-606010 RoHS/REACH)
Design Resources
1(Heat Sink Calculator)
Featured Product
1(Thermal Management Solutions)
Quantity Price
Quantity: 500
Unit Price: $2.37248
Packaging: Box
MinMultiplier: 500
Packaging: Box
MinMultiplier: 500
Substitutes
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