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Part Number Overview
Manufacturer Part Number
SIM-ST-MFF2
Description
GLOBAL IOT EMBEDDED SIM CHIP
Detailed Description
Manufacturer
Hologram, Inc.
Standard LeadTime
Edacad Model
SIM-ST-MFF2 Models
Standard Package
250
Supplier Stocks
Technical specifications
Mfr
Hologram, Inc.
Series
-
Package
Tape & Reel (TR)
Product Status
Discontinued at allaboutcomponents.com
Format
ESIM (MFF2)
Class
-
Memory
-
Core Processor
-
Carrier Network
-
Network Technology
2G, 3G, 4G LTE IOT
Features
-
Operating Temperature
-
Size / Dimension
5mm L x 6mm W x 0.82mm H
Environmental & Export Classifications
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
5A992C
HTSUS
8523.59.0000
Other Names
1887-1002-6
1887-1002-1
1887-1002-2
Category
/Product Index/RF and Wireless/Subscriber Identification Module (SIM) Cards/Hologram, Inc. SIM-ST-MFF2
Documents & Media
Datasheets
1(SIM Datasheet*)
HTML Datasheet
1(SIM Datasheet*)
EDA Models
1(SIM-ST-MFF2 Models)
Quantity Price
-
Substitutes
-