Part Number Overview

Manufacturer Part Number
70-0605-0810
Description
SOLDER PASTE NO CLEAN 500GM
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Manufacturer
Kester Solder
Standard LeadTime
3 Weeks
Edacad Model
Standard Package
Supplier Stocks

Technical specifications

Mfr
Kester Solder
Series
EM907
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 424°F (217 ~ 218°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
4 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
32°F ~ 50°F (0°C ~ 10°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Base Product Number
70-0605

Environmental & Export Classifications

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.90.0000

Other Names

-

Category

/Product Index/Soldering, Desoldering, Rework Products/Solder/Kester Solder 70-0605-0810

Documents & Media

Datasheets
1(EM907 Series Datasheet)
Other Related Documents
1(Alloy Temperature Chart)
MSDS Material Safety Datasheet
1(EM907 Lead-free Solder Paste SDS)

Quantity Price

Quantity: 10
Unit Price: $143.309
Packaging: Bulk
MinMultiplier: 10

Substitutes

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