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Part Number Overview
Manufacturer Part Number
MT29F512G08EBHAFB17A3WC1-R
Description
IC FLASH 512GBIT PARALLEL DIE
Detailed Description
FLASH - NAND (TLC) Memory IC 512Gbit Parallel Die
Manufacturer
Micron Technology Inc.
Standard LeadTime
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Micron Technology Inc.
Series
-
Package
Bulk
Product Status
Obsolete
allaboutcomponents.com Programmable
Not Verified
Memory Type
Non-Volatile
Memory Format
FLASH
Technology
FLASH - NAND (TLC)
Memory Size
512Gbit
Memory Organization
64G x 8
Memory Interface
Parallel
Write Cycle Time - Word, Page
-
Voltage - Supply
2.5V ~ 3.6V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
Die
Supplier Device Package
Die
Base Product Number
MT29F512G08
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
ECCN
3A991B1A
HTSUS
8542.32.0071
Other Names
-
Category
/Product Index/Integrated Circuits (ICs)/Memory/Memory/Micron Technology Inc. MT29F512G08EBHAFB17A3WC1-R
Documents & Media
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Quantity Price
-
Substitutes
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