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Part Number Overview
Manufacturer Part Number
IW-HSKALU-CLASLR-CU03
Description
ZU+ MPSOC SOM MODULE HEATSINK
Detailed Description
Heat Sink FPGA Aluminum Top Mount
Manufacturer
iWave Systems
Standard LeadTime
Edacad Model
Standard Package
1
Supplier Stocks
Technical specifications
Mfr
iWave Systems
Series
-
Package
Bulk
Product Status
Active
Type
Top Mount
Package Cooled
FPGA
Attachment Method
Bolt On
Shape
Rectangular, Fins
Length
3.740" (95.00mm)
Width
2.953" (75.00mm)
Diameter
-
Fin Height
1.181" (30.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Aluminum
Material Finish
-
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
7616.99.9000
Other Names
-
Category
/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/iWave Systems IW-HSKALU-CLASLR-CU03
Documents & Media
-
Quantity Price
Quantity: 1
Unit Price: $58
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-