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Part Number Overview
Manufacturer Part Number
NCSWLF.031 0.5OZ
Description
LF SOLDER WIRE MINI POCKET PACK
Detailed Description
No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 20 AWG, 21 SWG Tube, 0.50 oz (14.17g)
Manufacturer
Chip Quik Inc.
Standard LeadTime
4 Weeks
Edacad Model
Standard Package
1
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
-
Package
Bulk
Product Status
Active
Type
Wire Solder
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
0.031" (0.79mm)
Melting Point
423 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean
Wire Gauge
20 AWG, 21 SWG
Process
-
Form
Tube, 0.50 oz (14.17g)
Shelf Life
-
Shelf Life Start
-
Storage/Refrigeration Temperature
-
Base Product Number
NCSW
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.30.6000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. NCSWLF.031 0.5OZ
Documents & Media
Datasheets
1(NCSWLF.031 0.5OZ Datasheet)
HTML Datasheet
1(NCSWLF.031 0.5OZ Datasheet)
Quantity Price
Quantity: 1
Unit Price: $4.67
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
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