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Part Number Overview
Manufacturer Part Number
SMDSWLF.008 50G
Description
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Detailed Description
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 32 AWG, 35 SWG Spool, 1.76 oz (50g)
Manufacturer
Chip Quik Inc.
Standard LeadTime
4 Weeks
Edacad Model
Standard Package
1
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
SMD
Package
Bulk
Product Status
Active
Type
Wire Solder
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
0.008" (0.20mm)
Melting Point
423 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean, Water Soluble
Wire Gauge
32 AWG, 35 SWG
Process
Lead Free
Form
Spool, 1.76 oz (50g)
Shelf Life
-
Shelf Life Start
-
Storage/Refrigeration Temperature
-
allaboutcomponents.com Storage
-
Shipping Info
-
Base Product Number
SMDSW
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.30.3000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMDSWLF.008 50G
Documents & Media
Datasheets
1(SMDSWLF.008 50G Datasheet)
MSDS Material Safety Datasheet
1(LF Solder Wire SDS)
Featured Product
1(Ultra-Thin Series Solder Wire)
HTML Datasheet
1(SMDSWLF.008 50G Datasheet)
Quantity Price
Quantity: 1
Unit Price: $71.99
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
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