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Part Number Overview
Manufacturer Part Number
BGA0034-S
Description
BGA-676 (1.0 MM PITCH, 26 X 26 G
Detailed Description
Manufacturer
Chip Quik Inc.
Standard LeadTime
4 Weeks
Edacad Model
Standard Package
1
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
Proto-Advantage BGA
Package
Bulk
Product Status
Active
Type
BGA
Number of Positions
676
Pitch
0.039" (1.00mm)
Outer Dimension
2.600" L x 1.800" W (66.04mm x 45.72mm)
Inner Dimension
1.024" L x 1.024" W (26.00mm x 26.00mm)
Thermal Center Pad
-
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
7220.90.0080
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder Stencils, Templates/Chip Quik Inc. BGA0034-S
Documents & Media
Datasheets
1(BGA0034-S)
Video File
1(Prototyping with Solder Stencils - Another Teaching Moment | allaboutcomponents.com Electronics)
HTML Datasheet
1(BGA0034-S)
Quantity Price
Quantity: 1
Unit Price: $20.99
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-