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Germany833900T00000
Part Number Overview
Manufacturer Part Number
833900T00000
Description
HEATSINK STAMP 25.9X15X9.5MM
Detailed Description
Heat Sink TO-263 (D²Pak) Copper 2.0W @ 40°C Board Level
Manufacturer
Comair Rotron
Standard LeadTime
Edacad Model
Standard Package
50
Supplier Stocks
Technical specifications
Mfr
Comair Rotron
Series
-
Package
Bulk
Product Status
Obsolete
Type
Board Level
Package Cooled
TO-263 (D²Pak)
Attachment Method
SMD Pad
Shape
Rectangular, Fins
Length
0.591" (15.00mm)
Width
1.020" (25.91mm)
Diameter
-
Fin Height
0.375" (9.52mm)
Power Dissipation @ Temperature Rise
2.0W @ 40°C
Thermal Resistance @ Forced Air Flow
5.00°C/W @ 400 LFM
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
Tin
Environmental & Export Classifications
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
8473.30.5100
Other Names
CR504
833900T00000-ND
Category
/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/Comair Rotron 833900T00000
Documents & Media
Datasheets
()
HTML Datasheet
()
Product Drawings
1(833900T00000)
Quantity Price
-
Substitutes
-