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Part Number Overview
Manufacturer Part Number
PA0060-S
Description
QFN-16-THIN STENCIL
Detailed Description
Manufacturer
Chip Quik Inc.
Standard LeadTime
2 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
Proto-Advantage PA
Package
Bulk
Product Status
Active
Type
QFN/LFCSP
Number of Positions
16
Pitch
0.026" (0.65mm)
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension
0.157" L x 0.157" W (4.00mm x 4.00mm)
Thermal Center Pad
-
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
7218.10.0000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder Stencils, Templates/Chip Quik Inc. PA0060-S
Documents & Media
Datasheets
()
Video File
1(Prototyping with Solder Stencils - Another Teaching Moment | allaboutcomponents.com Electronics)
Featured Product
1(Adapters, Breadboards, and Accessories)
HTML Datasheet
()
Quantity Price
Quantity: 1
Unit Price: $11.59
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-