China
Spain
Rusia
Italy
GermanyPA0170
Part Number Overview
Manufacturer Part Number
PA0170
Description
MINI SOIC-8 EXP PAD TO DIP-8 SMT
Detailed Description
Manufacturer
Chip Quik Inc.
Standard LeadTime
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
Proto-Advantage
Package
Bulk
Product Status
Active
Proto Board Type
SMD to DIP
Package Accepted
MiniSOIC EP
Number of Positions
8
Pitch
0.026" (0.65mm)
Board Thickness
0.062" (1.57mm) 1/16"
Material
FR4 Epoxy Glass
Size / Dimension
0.700" x 0.400" (17.78mm x 10.16mm)
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
-
Category
/Product Index/Prototyping, Fabrication Products/Adapter, Breakout Boards/Chip Quik Inc. PA0170
Documents & Media
Datasheets
()
Video File
1(Surface Mount Pin Soldering of SMT to DIP Adapters)
Featured Product
()
HTML Datasheet
()
Quantity Price
Quantity: 1
Unit Price: $3.69
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
-