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CQ100GE 250G
Part Number Overview
Manufacturer Part Number
CQ100GE 250G
Description
GERMANIUM DOPED SOLDER PASTE NO-
Detailed Description
Lead Free No-Clean Solder Paste Sn99.244Cu0.7 (Ni0.05/Ge0.006) Jar, 8.8 oz (250g)
Manufacturer
Chip Quik Inc.
Standard LeadTime
4 Weeks
Edacad Model
Standard Package
1
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Technical specifications
Mfr
Chip Quik Inc.
Series
-
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Sn99.244Cu0.7 (Ni0.05/Ge0.006)
Diameter
-
Melting Point
441°F (227°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 8.8 oz (250g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
allaboutcomponents.com Storage
Refrigerated
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Base Product Number
CQ100G
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.90.0000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. CQ100GE 250G
Documents & Media
Datasheets
1(CQ100GE 250G Datasheet)
HTML Datasheet
1(CQ100GE 250G Datasheet)
Quantity Price
Quantity: 1
Unit Price: $58.95
Packaging: Bulk
MinMultiplier: 1
Substitutes
-
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