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Part Number Overview
Manufacturer Part Number
ATS-UC-QFLOW-200
Description
QUADFLOW HEATSINK 1U CU FINS
Detailed Description
Heat Sink Intel LGA2011 & LGA2066 CPU Cooler Copper Top Mount, Zipper Fin
Manufacturer
Advanced Thermal Solutions Inc.
Standard LeadTime
10 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Advanced Thermal Solutions Inc.
Series
quadFLOW™
Package
Box
Product Status
Active
Type
Top Mount, Zipper Fin
Package Cooled
Intel LGA2011 & LGA2066 CPU Cooler
Attachment Method
Push Pin
Shape
Square, Fins
Length
3.637" (92.38mm)
Width
3.626" (92.11mm)
Diameter
-
Fin Height
1.142" (29.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
Nickel
Base Product Number
ATS-UC
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8473.30.5100
Other Names
-
Category
/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/Advanced Thermal Solutions Inc. ATS-UC-QFLOW-200
Documents & Media
Datasheets
1(CPU Coolers)
Featured Product
1(dualFLOW™ and quadFLOW™ Ultra-Cool High-Performance Active Coolers)
Quantity Price
Quantity: 50
Unit Price: $135.7364
Packaging: Box
MinMultiplier: 1
Packaging: Box
MinMultiplier: 1
Quantity: 25
Unit Price: $140.7636
Packaging: Box
MinMultiplier: 1
Packaging: Box
MinMultiplier: 1
Quantity: 10
Unit Price: $150.818
Packaging: Box
MinMultiplier: 1
Packaging: Box
MinMultiplier: 1
Quantity: 1
Unit Price: $160.87
Packaging: Box
MinMultiplier: 1
Packaging: Box
MinMultiplier: 1
Substitutes
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