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Part Number Overview
Manufacturer Part Number
100-008-001
Description
CONN IC DIP SOCKET 8POS GOLD
Detailed Description
8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Manufacturer
3M
Standard LeadTime
Edacad Model
Standard Package
200
Supplier Stocks
Technical specifications
Mfr
3M
Series
100
Package
Bulk
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
8 (2 x 4)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
8.00µin (0.203µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame, Seal Tape
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
Flash
Contact Material - Post
Brass
Housing Material
Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature
-65°C ~ 125°C
Termination Post Length
0.126" (3.20mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
-
Base Product Number
100-008
Environmental & Export Classifications
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
05111165333
JE150135893
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/3M 100-008-001
Documents & Media
Datasheets
1(1x0-0xx-05y)
HTML Datasheet
1(1x0-0xx-05y)
Quantity Price
-
Substitutes
-