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SMDLTLFP10T4
Part Number Overview
Manufacturer Part Number
SMDLTLFP10T4
Description
SOLDER PASTE LOW TEMP T4 10CC
Detailed Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 1.23 oz (35g), 10cc
Manufacturer
Chip Quik Inc.
Standard LeadTime
4 Weeks
Edacad Model
Standard Package
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Technical specifications
Mfr
Chip Quik Inc.
Series
-
Package
Syringe
Product Status
Active
Type
Solder Paste
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
281°F (138°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Syringe, 1.23 oz (35g), 10cc
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
allaboutcomponents.com Storage
Refrigerated
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Base Product Number
SMDLTL
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMDLTLFP10T4
Documents & Media
Datasheets
1(SMDLTLFP10T4 Data Sheet)
MSDS Material Safety Datasheet
1(SMDLTLFP Series)
HTML Datasheet
1(SMDLTLFP10T4 Data Sheet)
Quantity Price
Quantity: 1
Unit Price: $26.95
Packaging: Syringe
MinMultiplier: 1
Substitutes
-
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