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Part Number Overview
Manufacturer Part Number
532-AG10D
Description
CONN IC DIP SOCKET 32POS GOLD
Detailed Description
32 (2 x 16) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
Manufacturer
TE Connectivity AMP Connectors
Standard LeadTime
Edacad Model
Standard Package
15
Supplier Stocks
Technical specifications
Mfr
TE Connectivity AMP Connectors
Series
500
Package
Bulk
Product Status
Obsolete
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
32 (2 x 16)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
25.0µin (0.63µm)
Contact Material - Mating
Copper Alloy
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
25.0µin (0.63µm)
Contact Material - Post
Copper Alloy
Housing Material
Polyester
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
-
Base Product Number
532
Environmental & Export Classifications
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
5-1437532-8
5-1437532-8-ND
-532-AG10D-SI
514375328
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 532-AG10D
Documents & Media
Datasheets
1(1437532)
Environmental Information
1(5-1437532-8 Statement of Compliance)
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
HTML Datasheet
1(1437532)
Quantity Price
-
Substitutes
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