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Part Number Overview
Manufacturer Part Number
18-68587-10
Description
CONN IC DIP SOCKET 18POS TIN
Detailed Description
18 (2 x 9) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin Through Hole
Manufacturer
Aries Electronics
Standard LeadTime
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Aries Electronics
Series
8
Package
Bulk
Product Status
Active
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
18 (2 x 9)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
200.0µin (5.08µm)
Contact Material - Mating
Phosphor Bronze
Mounting Type
Through Hole
Features
Closed Frame, Elevated
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Phosphor Bronze
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.140" (3.56mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
-
Base Product Number
18-6858
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
-
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 18-68587-10
Documents & Media
Datasheets
1(8 Series Elevator Socket)
Environmental Information
()
HTML Datasheet
1(8 Series Elevator Socket)
Quantity Price
-
Substitutes
-