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Part Number Overview
Manufacturer Part Number
TS991SNL500T3
Description
SOLDER PASTE THERMALLY STABLE NC
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Manufacturer
Chip Quik Inc.
Standard LeadTime
4 Weeks
Edacad Model
Standard Package
1
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
CHIPQUIK®
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423°F (217°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Base Product Number
TS991S
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. TS991SNL500T3
Documents & Media
Datasheets
1(TS991SNL500T3 Datasheet)
Quantity Price
Quantity: 100
Unit Price: $69.795
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Quantity: 10
Unit Price: $87.244
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Quantity: 1
Unit Price: $107.19
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
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