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Part Number Overview
Manufacturer Part Number
96-100M65
Description
SOCKET ADAPTER QFP TO 100PGA
Detailed Description
IC Socket Adapter QFP To PGA Through Hole
Manufacturer
Aries Electronics
Standard LeadTime
Edacad Model
Standard Package
1
Supplier Stocks
Technical specifications
Mfr
Aries Electronics
Series
-
Product Status
Obsolete
Convert From (Adapter End)
QFP
Convert To (Adapter End)
PGA
Number of Pins
100
Pitch - Mating
0.026" (0.65mm)
Contact Finish - Mating
Tin
Mounting Type
Through Hole
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Housing Material
-
Board Material
FR4 Epoxy Glass
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
-
Features
-
Operating Temperature
-
Contact Material - Mating
Copper
Contact Material - Post
Brass
Contact Finish Thickness - Mating
-
Contact Finish Thickness - Post
200.0µin (5.08µm)
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
A175
A175-NDR
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/Socket Adapters/Aries Electronics 96-100M65
Documents & Media
Datasheets
1(96-100M65)
Environmental Information
()
HTML Datasheet
1(96-100M65)
Quantity Price
-
Substitutes
-