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Part Number Overview
Manufacturer Part Number
7131-108-18
Description
SOCKET ADAPT HB2E RELAY TO 8DIP
Detailed Description
IC Socket Adapter HB2E Relay To DIP, 0.3" (7.62mm) Row Spacing Through Hole
Manufacturer
Aries Electronics
Standard LeadTime
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Aries Electronics
Series
-
Package
Bulk
Product Status
Active
Convert From (Adapter End)
HB2E Relay
Convert To (Adapter End)
DIP, 0.3" (7.62mm) Row Spacing
Number of Pins
8
Pitch - Mating
-
Contact Finish - Mating
-
Mounting Type
Through Hole
Termination
Solder
Pitch - Post
-
Contact Finish - Post
Tin-Lead
Housing Material
-
Board Material
FR4 Epoxy Glass
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
-
Features
-
Operating Temperature
-
Contact Material - Mating
-
Contact Material - Post
Brass
Contact Finish Thickness - Mating
-
Contact Finish Thickness - Post
200.0µin (5.08µm)
Base Product Number
7131-10
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
-
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/Socket Adapters/Aries Electronics 7131-108-18
Documents & Media
Other Related Documents
1(Custom Correct-A-Chip® Adapters)
Environmental Information
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Quantity Price
-
Substitutes
-