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Germany550-10-500M30-001152
Part Number Overview
Manufacturer Part Number
550-10-500M30-001152
Description
BGA SOLDER TAIL
Detailed Description
500 (30 x 30) Pos BGA Socket Gold Through Hole
Manufacturer
Preci-Dip
Standard LeadTime
20 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Preci-Dip
Series
550
Package
Bulk
Product Status
Active
Type
BGA
Number of Positions or Pins (Grid)
500 (30 x 30)
Pitch - Mating
0.050" (1.27mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Brass
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.050" (1.27mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Material - Post
Brass
Housing Material
FR4 Epoxy Glass
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.086" (2.20mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
10mOhm
Base Product Number
550-10
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
-
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Preci-Dip 550-10-500M30-001152
Documents & Media
Datasheets
()
Video File
1(PRODUCT DESIGN TIPS v017 microPGA Sockets and BGA Adapters)
Environmental Information
1(Preci-Dip Regulatory Info)
HTML Datasheet
1(550-10-yyyMxx-zzz152)
Quantity Price
Quantity: 312
Unit Price: $42.68455
Packaging: Bulk
MinMultiplier: 312
Packaging: Bulk
MinMultiplier: 312
Substitutes
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