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Part Number Overview
Manufacturer Part Number
SMD291SNL50T6
Description
SOLDER PASTE IN JAR 50G (T6) SAC
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)
Manufacturer
Chip Quik Inc.
Standard LeadTime
4 Weeks
Edacad Model
Standard Package
1
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
SMD
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
422 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
6
Process
Lead Free
Form
Jar, 1.76 oz (50g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Base Product Number
SMD291
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.90.0000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMD291SNL50T6
Documents & Media
Datasheets
1(SMD291SNL50T6)
MSDS Material Safety Datasheet
1(Lead Free Solder Paste SDS)
HTML Datasheet
1(SMD291SNL50T6)
Quantity Price
Quantity: 1
Unit Price: $99.95
Packaging: Bulk
MinMultiplier: 1
Packaging: Bulk
MinMultiplier: 1
Substitutes
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