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Part Number Overview
Manufacturer Part Number
0C97055902
Description
RFI EMI GROUNDING MATERIAL 25FT
Detailed Description
Manufacturer
Laird Technologies EMI
Standard LeadTime
Edacad Model
Standard Package
25
Supplier Stocks
Technical specifications
Mfr
Laird Technologies EMI
Series
Twist
Package
Bulk
Product Status
Active
Type
Fingerstock
Shape
-
Width
0.300" (7.62mm)
Length
24.000" (609.60mm)
Height
0.070" (1.78mm)
Material
Beryllium Copper
Plating
Unplated
Plating - Thickness
-
Attachment Method
Adhesive
Operating Temperature
121°C
Shelf Life Start
-
Shelf Life
-
Storage/Refrigeration Temperature
-
Environmental & Export Classifications
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
4016.93.1050
Other Names
-
Category
/Product Index/RF and Wireless/RFI and EMI - Contacts, Fingerstock and Gaskets/Laird Technologies EMI 0C97055902
Documents & Media
Datasheets
1(Low Profile Gasket Catalog)
Video File
1(Laird’s Precision Metals Production and Design Capabilities Overview)
HTML Datasheet
1(Low Profile Gasket Catalog)
Quantity Price
-
Substitutes
-