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Part Number Overview
Manufacturer Part Number
528-AG11D-ESL
Description
CONN IC DIP SOCKET 28POS GOLD
Detailed Description
28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
Manufacturer
TE Connectivity AMP Connectors
Standard LeadTime
Edacad Model
Standard Package
425
Supplier Stocks
Technical specifications
Mfr
TE Connectivity AMP Connectors
Series
500
Package
Bulk
Product Status
Obsolete
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
28 (2 x 14)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
5.00µin (0.127µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
5.00µin (0.127µm)
Contact Material - Post
Brass, Copper
Housing Material
Polyester
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
10mOhm
Base Product Number
528
Environmental & Export Classifications
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Affected
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
-
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 528-AG11D-ESL
Documents & Media
Datasheets
1(500 Series)
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
Quantity Price
-
Substitutes
-