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Part Number Overview
Manufacturer Part Number
518-AG11D-ES
Description
CONN IC DIP SOCKET 18POS GOLD
Detailed Description
18 (2 x 9) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Manufacturer
TE Connectivity AMP Connectors
Standard LeadTime
Edacad Model
518-AG11D-ES Models
Standard Package
1,040
Supplier Stocks
Technical specifications
Mfr
TE Connectivity AMP Connectors
Series
500
Package
Bulk
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
18 (2 x 9)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
25.0µin (0.63µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
25.0µin (0.63µm)
Contact Material - Post
Beryllium Copper
Housing Material
Polyester
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
10mOhm
Base Product Number
518
Environmental & Export Classifications
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
-
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 518-AG11D-ES
Documents & Media
Datasheets
1(DIP SOCKETS Quick Reference Guide)
CAD Models
1(518-AG11D-ES Models)
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
3D Drawings
1(518-AG11D-ES 3D Drawing)
Quantity Price
-
Substitutes
-