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Part Number Overview
Manufacturer Part Number
04-1508-21
Description
CONN IC DIP SOCKET 4POS GOLD
Detailed Description
4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
Manufacturer
Aries Electronics
Standard LeadTime
5 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Aries Electronics
Series
508
Package
Bulk
Product Status
Active
Type
DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)
4 (2 x 2)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Wire Wrap
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.360" (9.14mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
04-1508
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
-
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 04-1508-21
Documents & Media
Datasheets
1(508 Series Sgl/Dual Wire Wrap)
Environmental Information
()
HTML Datasheet
1(508 Series Sgl/Dual Wire Wrap)
Quantity Price
Quantity: 172
Unit Price: $2.94919
Packaging: Bulk
MinMultiplier: 172
Packaging: Bulk
MinMultiplier: 172
Substitutes
-