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Part Number Overview
Manufacturer Part Number
26-1518-11
Description
CONN IC DIP SOCKET 26POS GOLD
Detailed Description
26 (2 x 13) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
Manufacturer
Aries Electronics
Standard LeadTime
5 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Aries Electronics
Series
518
Package
Bulk
Product Status
Active
Type
DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)
26 (2 x 13)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
26-1518
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
-
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 26-1518-11
Documents & Media
Datasheets
1(518 Series Sgl/Dual Solder Pin)
Environmental Information
()
HTML Datasheet
1(518 Series Sgl/Dual Solder Pin)
Quantity Price
Quantity: 144
Unit Price: $3.51479
Packaging: Bulk
MinMultiplier: 144
Packaging: Bulk
MinMultiplier: 144
Substitutes
-