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Part Number Overview
Manufacturer Part Number
70-0306-0810
Description
SOLDER PASTE WATER SOLUBLE 500GM
Detailed Description
Lead Free Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Manufacturer
Kester Solder
Standard LeadTime
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Kester Solder
Series
EM808
Package
Bulk
Product Status
Obsolete
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 424°F (217 ~ 218°C)
Flux Type
Water Soluble
Wire Gauge
-
Mesh Type
-
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
32°F ~ 50°F (0°C ~ 10°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.90.0000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder/Kester Solder 70-0306-0810
Documents & Media
Datasheets
1(EM808 Series Datasheet)
Other Related Documents
1(Alloy Temperature Chart)
HTML Datasheet
1(EM808 Series Datasheet)
Quantity Price
-
Substitutes
-